Product Overview
The Huawei FusionServer CH220 V3 is a high-performance, I/O-optimized blade compute node purpose-built for the Huawei E9000 blade chassis platform. Designed to balance powerful processing, large memory capacity, and flexible I/O expansion, this node supports Intel Xeon E5-2600 V3 series processors and features 16 DDR4 DIMM memory slots. It excels in demanding workloads requiring both strong compute capability and high-speed connectivity, such as virtualization, cloud infrastructure, enterprise databases, and big data processing. As a fully integrated blade module, it enables high-density, efficient, and reliable deployment for modern enterprise data centers.
Core Competitive Advantages
1. Stable & Powerful Intel Xeon E5-2600 V3 Performance
Powered by the mature Intel Xeon E5-2600 V3 Haswell architecture, the CH220 V3 delivers exceptional multi-core and multi-threaded processing power. It handles high-concurrency applications, virtual machine clusters, database queries, and enterprise business workloads with low latency and consistent throughput, ensuring reliable 7*24 continuous operation for critical business systems.
2. 16 DDR4 DIMMs for Massive Memory Expansion
With 16 DDR4 DIMM slots, the CH220 V3 offers industry-leading memory scalability. High-bandwidth DDR4 memory eliminates bottlenecks in memory-intensive tasks like in-memory databases, large-scale virtualization, and big data analytics, ensuring smooth performance even under heavy multi-tasking loads
3. Enhanced I/O Expansion for Flexible Connectivity
Optimized for high-throughput scenarios, the CH220 V3 features enhanced I/O expansion capabilities, supporting multiple network adapters, storage controllers, and expansion cards. This makes it ideal for building high-performance enterprise networks, storage clusters, and hybrid workload environments requiring flexible connectivity options
4. High-Density Blade Design for E9000 Chassis
As a blade compute node, the CH220 V3 fits seamlessly into the Huawei E9000 chassis, sharing unified power, cooling, and management resources. This design maximizes rack space utilization, reduces cabling complexity, and lowers overall data center infrastructure costs, making it ideal for large-scale cluster deployment.
5. Enterprise-Grade Reliability & Low TCO
Built with industrial-grade components and intelligent thermal management, the CH220 V3 ensures long-term stable operation with minimal failure rates. It supports centralized remote management via the E9000 chassis, simplifying daily maintenance and reducing operational costs, delivering a low total cost of ownership (TCO) for enterprise IT infrastructure.
Key Product Features
- Supports Intel Xeon E5-2600 V3 series dual-socket enterprise processors
- 16 DDR4 DIMM slots for high-capacity, high-bandwidth memory expansion
- Enhanced I/O expansion capability for flexible network and storage connectivity
- Optimized for Huawei E9000 blade chassis, enabling high-density deployment
- Blade form factor with shared power, cooling, and management resources
- Centralized remote monitoring and fault management via chassis controller
- Enterprise-grade stability for 7*24-hour uninterrupted operation
Huawei CH220-V3-I/O Specification
| Model |
Huawei CH220 V3 I/O Expansion Compute Node |
| Brand |
Huawei |
| Form Factor |
Full-width 2-socket compute node |
| Number of Processors |
1 or 2 |
| Processor Model |
Intel® Xeon® E5-2600 v3/v4 series |
| Number of DIMMs |
16 DDR4 DIMMs, up to 1TB memory capacity |
| Number of Hard Disks |
2 x 2.5-inch SSDs, SAS HDDs, or SATA HDDs |
| Built-in Storage |
2 x Mini-SSDs (SATA DOM); 2 x Micro-SD cards (RAID 1); 1 x USB 3.0 |
| RAID Support |
RAID 0 and RAID 1 |
| PCIe Expansion |
2 PCIe x16 + 2 PCIe x8 Mezz modules, supporting 6 standard PCIe slots: 6 full-height, half-length single slots; or 1 full-height, full-length dual slot + 4 full-height, half-length single slots; or 2 full-height, full-length dual slots; or 2 full-height, full-length single slots + 4 full-height, half-length single slots |
| Operating Systems Supported |
|
| Operating Temperature |
5°C to 40°C, ASHRAE Class A3 compliant |
| Dimensions (H x W x D) |
60.46mm x 423mm x 537.2mm (2.38in. x 16.65in. x 21.15in.) |
| Weight |
10 kg |
Application Scenarios
The Huawei CH220 V3 I/O Expansion Compute Node is ideal for scenarios requiring both strong computing power and flexible I/O connectivity:
- Enterprise virtualization and private cloud platforms
- Large-scale database and application server clusters
- High-concurrency web and service applications
- Big data processing and analytics environments
- High-performance computing (HPC) clusters
- Data center high-density compute node deployment
